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TLV9301, TLV9302, TLV9304

SBOS941A – FEBRUARY 2019 – REVISED APRIL 2019

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Product Folder Links: TLV9302

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Copyright © 2019, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

This package option is preview for TLV9302.

6.5 Thermal Information for Dual Channel

TLV9302

UNIT

D (SOIC)

8 PINS

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal

resistance

138.7

TBD

TBD

188.4

°C/W

Junction-to-case (top) thermal

resistance

78.7

TBD

TBD

77.1

°C/W

Junction-to-board thermal resistance

82.2

TBD

TBD

119.1

°C/W

Junction-to-top characterization

parameter

27.8

TBD

TBD

14.2

°C/W

Junction-to-board characterization

parameter

81.4

TBD

TBD

117.4

°C/W

Junction-to-case (bottom) thermal

resistance

N/A

TBD

TBD

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

This package option is preview for TLV9304.

6.6 Thermal Information for Quad Channel

TLV9304

UNIT

14 PINS

14 PINS

Junction-to-ambient thermal resistance

TBD

TBD

°C/W

Junction-to-case (top) thermal resistance

TBD

TBD

°C/W

Junction-to-board thermal resistance

TBD

TBD

°C/W

Junction-to-top characterization parameter

TBD

TBD

°C/W

Junction-to-board characterization parameter

TBD

TBD

°C/W

Junction-to-case (bottom) thermal resistance

TBD

TBD

°C/W