LM2931 Series

3

MOTOROLA ANALOG IC DEVICE DATA

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage Continuous

VI

40

Vdc

Transient Input Voltage (

τ ≤ 100 ms)

VI(τ)

60

Vpk

Transient Reverse Polarity Input Voltage

–VI(τ)

Vpk

1.0% Duty Cycle,

τ ≤ 100 ms

Power Dissipation

Case 29 (TO–92 Type)

TA = 25°C

PD

Internally Limited

W

Thermal Resistance, Junction–to–Ambient

R

θJA

178

°C/W

Thermal Resistance, Junction–to–Case

R

θJC

83

°C/W

Case 221A, 314A, 314B and 314D (TO–220 Type)

TA = 25°C

PD

Internally Limited

W

Thermal Resistance, Junction–to–Ambient

R

θJA

65

°C/W

Thermal Resistance, Junction–to–Case

R

θJC

5.0

°C/W

Case 369 and 369A (DPAK) [Note 1]

TA = 25°C

PD

Internally Limited

W

Thermal Resistance, Junction–to–Ambient

R

θJA

92

°C/W

Thermal Resistance, Junction–to–Case

R

θJC

6.0

°C/W

Case 751 (SOP–8) [Note 2]

TA = 25°C

PD

Internally Limited

W

Thermal Resistance, Junction–to–Ambient

R

θJA

160

°C/W

Thermal Resistance, Junction–to–Case

R

θJC

25

°C/W

Case 936 and 936A (D2PAK) [Note 3]

TA = 25°C

PD

Internally Limited

W

Thermal Resistance, Junction–to–Ambient

R

θJA

70

°C/W

Thermal Resistance, Junction–to–Case

R

θJC

5.0

°C/W

Tested Operating Junction Temperature Range

TJ

– 40 to +125

°C

Storage Temperature Range

Tstg

– 65 to +150

°C

NOTES: 1. DPAK Junction–to–Ambient Thermal Resistance is for vertical mounting. Refer to Figure 24 for

board mounted Thermal Resistance.

2. SOP–8 Junction–to–Ambient Thermal Resistance is for minimum recommended pad size. Refer

to Figure 23 for Thermal Resistance variation versus pad size.

3. D2PAK Junction–to–Ambient Thermal Resistance is for vertical mounting. Refer to Figure 25 for

board mounted Thermal Resistance.

4. ESD data available upon request.

Ch

i i

Sb l

LM2931–5.0

LM2931A–5.0

Ui

Characteristic

Symbol

Min

Typ

Max

Min

Typ

Max

Unit

FIXED OUTPUT

Output Voltage

VO

V

Vin = 14 V, IO = 10 mA, TJ = 25°C

4.75

5.0

5.25

4.81

5.0

5.19

Vin = 6.0 V to 26 V, IO ≤ 100 mA, TJ = – 40° to +125°C

4.50

–

5.50

4.75

–

5.25

Line Regulation

Regline

mV

Vin = 9.0 V to 16 V

–

2.0

10

–

2.0

10

Vin = 6.0 V to 26 V

–

4.0

30

–

4.0

30

Load Regulation (IO = 5.0 mA to 100 mA)

Regload

–

14

50

–

14

50

mV

Output Impedance

ZO

m

Ω

IO = 10 mA, ∆IO = 1.0 mA, f = 100 Hz to 10 kHz

–

200

–

–

200

–

Bias Current

IB

mA

Vin = 14 V, IO = 100 mA, TJ = 25°C

–

5.8

30

–

5.8

30

Vin = 6.0 V to 26 V, IO = 10 mA, TJ = – 40° to +125°C

–

0.4

1.0

–

0.4

1.0

Output Noise Voltage (f = 10 Hz to 100 kHz)

Vn

–

700

–

–

700

–

µVrms

Long Term Stability

S

–

20

–

–

20

–

mV/kHR

NOTES: 1. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.

2. The reference voltage on the adjustable device is measured from the output to the adjust pin across R1.