Approval sheet

Page 6 of 7

WR18-20-25X(W)_V17

DEC - 2016

TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)

Essentially all tests are carried out according to the schedule of IEC publication 115-8, category LCT/UCT/56 (rated

temperature range : Lower Category Temperature, Upper Category Temperature; damp heat, long term, 56 days). The

testing also meets the requirements specified by EIA, EIAJ and JIS.

The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical robustness

testing procedure for electronic components" and under standard atmospheric conditions according to IEC 60068-1,

subclause 5.3. Unless otherwise specified, the following value supplied :

Temperature: 15°C to 35°C.

Relative humidity: 45% to 75%.

Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).

All soldering tests are performed with midly activated flux.

TEST

PROCEDURE

REQUIREMENT

DC resistance

Clause 4.5

DC resistance values measured at the test voltages specified below :

<10

@0.1V,<100@0.3V, <1K@1.0V, <10K@3V,

<100K

@10V, <1M@25V, <10M@30V

Within the specified

tolerance

Temperature

Coefficient of

Resistance(T.C.R)

Clause 4.8

Natural resistance change per change in degree centigrade.





6

1

2

1

1

2

10







t

t

R

R

R

(ppm/

C) t

Refer to

“QUICK REFERENCE

DATA”

Short time overload

(S.T.O.L) Clause

Clause 4.13

Permanent resistance change after a 5second application of a voltage

2.5 times RCWV or the maximum overload voltage specified in the

above list, whichever is less.

R/R max. ±(2%+0.1)

Resistance to

soldering heat(R.S.H)

Clause 4.18

Un-mounted chips completely immersed for 10±1second in a SAC

solder bath at 260℃±5ºC

no visible damage

 R/R max. ±(1%+0.05)

Solderability

Clause 4.17

Un-mounted chips completely immersed for 2±0.5 second in a SAC

solder bath at 235℃±5℃

good tinning (>95%

covered)

no visible damage

Temperature cycling

Clause 4.19

30 minutes at -55

C3C, 2~3 minutes at 20°C+5°C-1°C, 30 minutes

at +155

C3C, 2~3 minutes at 20°C+5°C-1°C, total 5 continuous

cycles

no visible damage

R/R max. ±(1%+0.05)

Load life (endurance)

Clause 4.25

1000 +48/-0 hours, loaded with RCWV or Vmax in chamber controller

70±2ºC, 1.5 hours on and 0.5 hours off

R/R max. (3%+0.1)

Load life in Humidity

Clause 4.24

1000 +48/-0 hours, loaded with RCWV or Vmax in humidity chamber

controller at 40

C2C and 90~95% relative humidity, 1.5hours on and

0.5 hours off

R/R max. (3%+0.1)

Bending strength

Clause 4.33

Resistors mounted on a 90mm glass epoxy resin PCB(FR4);

bending : 2 mm, once for 10 seconds

R/R max. ±(1%+0.05)

Adhesion

Clause 4.32

Pressurizing force: 5N, Test time: 10±1sec.

No remarkable damage or

removal of the terminations

Insulation Resistance

Clause 4.6

Apply the maximum overload voltage (DC) for 1minute

R≧10GΩ

Dielectric Withstand

Voltage

Clause 4.7

Apply the maximum overload voltage (AC) for 1 minute

No breakdown or flashover