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RFASWAM3489ATF09 Datasheet(PDF) 6 Page - WALSIN TECHNOLOGY CORPORATION |
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RFASWAM3489ATF09 Datasheet(HTML) 6 Page - WALSIN TECHNOLOGY CORPORATION |
6 / 8 page Approval Sheet Page 6 of 8 ASC_RFASWAM3489ATF09_V04 Mar. 2018 Reliability test TEST PROCEDURE / TEST METHOD REQUIREMENT *Solderability *JIS C 0050-4.6 *JESD22-B102D *Solder bath temperature:255 5C *Immersion time:5 0.5 sec *Solder:Sn3Ag0.5Cu for lead-free *At least 95% of a surface of each terminal *electrode must be covered by fresh solder. *High temperature *JIS C 0021 *Temperature:90 C2C *Test duration:1000+24/-0 hours *Measurement to be made after keeping at *room temperature for 24 2 hrs *No mechanical damage. *Electrical specification shall satisfy the *descriptions in electrical characteristics under *the operational temperature range within -30 *~ 90°C. *Low temperature *JIS C 0020 *Temperature:-30 C2C *Test duration:1000+24/-0 hours *Measurement to be made after keeping at *room temperature for 24 2 hrs *No mechanical damage. *Electrical specification shall satisfy the *descriptions in electrical characteristics under *the operational temperature range within -30 *~ 90°C. *Temperature cycle *JIS C 0025 *1. 30 3 minutes at -303C, *2. 10~15 minutes at room temperature, *3. 30 3 minutes at +903C, *4. 10~15 minutes at room temperature, *Total 100 continuous cycles *Measurement to be made after keeping at *room temperature for 24 2 hrs *No mechanical damage. *Electrical specification shall satisfy the *descriptions in electrical characteristics under *the operational temperature range within -30 *~ 90°C. *High temperature operation *life (HTOL) *Temperature:90 C *VDD = 4.8V *Time:1000+24/-0 hrs. *Measurement to be made after keeping at *room temperature for 24 2 hrs *No mechanical damage. *Electrical specification shall satisfy the *descriptions in electrical characteristics under *the operational temperature range within -30 *~ 90°C. Soldering condition Typical examples of soldering processes that provide reliable joints without any damage are given in Figure 11. 3 Figure 11. Infrared soldering profile 260 245 217 200 150 10 sec Time 30 sec min. 60~150 sec 480 sec max. to Peak 25 max. ramp up rate = 3°C/s max. ramp down rate = 6°C/s For SnAgCu series solder paste |
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