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MIC4609 Datasheet(PDF) 5 Page - Microchip Technology

Part # MIC4609
Description  600V 3-Phase MOSFET/IGBT Driver
PDF  34 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MIC4609 Datasheet(HTML) 5 Page - Microchip Technology

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 2016 Microchip Technology Inc.
DS20005531A-page 5
MIC4609
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VDD, VXHB - VXHS) .................. -0.3V to +25V
Input Voltages (V
X
LI, VXHI, VEN) .......................... -0.3V to VDD
Voltage on LO (V
X
LO) .......................................... -0.3V to VDD
Voltage on HO (V
X
HO) .................................VHS - 0.3V to VHB
Voltage on HS .................................................... -5V to +630V
Voltage on HB ...............................................................+655V
Storage Temperature ...................................-60°C to +150°C
ESD Rating
HBM .......................................................................... 2kV
CDM...................................................................... 1.5 kV
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification
is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
Operating Ratings (1)
Supply Voltage (VDD) ....................................... +10V to +20V
Voltage on xHS (continuous) ............................. -1V to +600V
Voltage on xHS (repetitive transient) ................. -5V to +600V
HS Slew Rate .............................................................. 50V/ns
Voltage on xHB .............................V
X
HS + 10V to VXHS + 20V
and/or ........................................VDD - 1V to VDD + 600V
Junction Temperature (TJ) ........................... -40°C to +125°C
Junction Thermal Resistance (
JA).............. -40°C to +125°C
SOIC Wide 28LD ................................................ 53°C/W
Note
1: The device is not guaranteed to function
outside its operating rating.
AC/DC ELECTRICAL CHARACTERISTICS (Note 1, 2)
Electrical Specifications: Unless otherwise indicated, VDD = VxHB = 20V, VEN = 5V, VSS = VxHS = 0V; No load on
xLO or xHO, TA = +25°C. Bold values indicate -40°C TJ +125°C.
Parameter
Sym.
Min.
Typ.
Max.
Unit
Conditions
Supply Current
VDD Quiescent Current
IDD
—150
250
µA
xLI = xHI = 0V
VDD Shutdown Current
IDDSH
—0.1
10
µA
EN = 0V with HS = floating
or ground
VDD Operating Current
IDDO
—240
350
µA
f = 20 kHz
Total xHB Quiescent Current
IxHB
—81
180
µA
xLI = xHI = 0V or
xLI = 0V and xHI = 5V
Total xHB Operating Current
IxHBO
—600
1500
µA
f = 20 kHz
High-Side Leakage Current
ILxHB
—1
10
µA
VxHB = VxHS = 600V
Input (TTL: xLI, xHI, EN)
Low-Level Input Voltage
VIL
——
0.8
V
High-Level Input Voltage
VIH
2.2
——
V
Input Voltage Hysteresis
VHYS
—0.2
—
V
Input Pull-Down Resistance
RI
100
370
500
k
For xLI and xHI only (Note 3)
Undervoltage Protection
VDD Falling Threshold
VDDR
7
8
9
V
VDD Threshold Hysteresis
VDDH
—0.5
—
V
xHB Falling Threshold
VxHBR
7
8
9
V
xHB Threshold Hysteresis
VxHBH
—0.5
—
V
Note 1:
Specification for packaged product only.
2:
The x in the suffix of a pin name designates any of the three phases, e.g., xHS refers to either AHS, BHS
or CHS.
3:
Enable resistance is typical only and is not production tested.



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