LLC

ABRACON IS

ISO9001-2015

CERTIFIED

5101 Hidden Creek Ln Spicewood TX 78669

Phone: 512-371-6159 | Fax: 512-351-8858

For terms and conditions of sales, please visit:

www.abracon.com

REVISED: 11.09.2018

Low Profile Dual Band WiFi Chip Antenna

Pb

3.05 x 1.60 x 0.55 mm

MSL = 1

ACAR0301-SW2

Reflow Soldering Standard Condition

Abracon products can be assembled following Pb-free assembly.

According to the Standard IPC/JEDEC J-STD-020C, the temperature profile suggested is as follow:

Phase

Profile Features

Pb-Free Assembly

(SnAgCu)

Pre-Heat

-Temperature Min (Tsmin)

-Temperature Max (Tsmax)

-Time (ts) from (Tsmin to Tsmax)

150°C

200°C

60-120 seconds

Ramp-Up

Avg. Ramp-up Rate (Tsmax to TP)

3°C /second(max)

Reflow

-Temperature (TL)

-Total Time above TL (t L)

217°C

30-100 seconds

Peak

-Temperature (TP)

-Time (tp)

260°C

5-10 second RAMP

Ramp-Down

Rate

6°C / second max.

Time from 25°C to Peak Temperature

8 minutes max.

Composition of solder paste

96.5Sn/3Ag/0.5Cu

Solder Paste Model

SHENMAO PF606-P26

Note : All the temperature measure point is on top surface of the component, if temperature over recommend, it will make

component surface peeling or damage.