TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Symbol

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Operating Temperature Range (T)

–40

—

+85

°C

Ordering Option I

–40

—

+105

°C

Ordering Option L

–40

—

+125

°C

Ordering Option A

Junction Operating Temperature

—

—

+150

°C

—

Storage Temperature Range

–40

—

+150

°C

—

Soldering Temperature Range

—

—

+260

°C

40 sec. max.

Package Thermal Resistance

6-Lead VDFN 5.0 mm x 3.0 mm (B)

—

—

26

°C/W

—

6-Lead VDFN 3.2 mm x 2.5 mm (C)

—

—

45

—

6-Lead VDFN 2.5 mm x 2.0 mm (D)

—

—

258

—

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.

DSA1103/23

DS20005891A-page 4

 2019 Microchip Technology Inc.