Custom MMIC

300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294

Visit us online at www.custommmic.com

ver 1.0 0517

Mechanical Information

Die Outline (all dimensions in microns)

Notes:

1. No connection required for unlabeled pads

2. Backside is RF and DC ground

3. Backside and bond pad metal: Gold

4. Die is 100 microns thick

5. DC bond pad (2) is 100 microns square

6. RF bond pads (1, 3) are 100 x 150 microns

CMD263

5-11 GHz Low Noise Amplifier

1

2

3

740

1350

1226

1350