IP3348CX5_CX10_CX15_CX20

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 1.1 — 4 April 2011

12 of 16

NXP Semiconductors

IP3348CX5/CX10/CX15/CX20

Multi channel LC-filter network for high-speed data interfaces

9.

Design and assembly recommendations

9.1 PCB design guidelines

It is recommended, for optimum performance, to use a Non-Solder Mask Defined

(NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias

connecting the ground pads to a buried ground-plane layer. This results in the lowest

possible ground inductance and provides the best high frequency and ESD performance.

Refer to Table 11 for the recommended PCB design parameters.

9.2 PCB assembly guidelines for Pb-free soldering

Table 11.

Recommended PCB design parameters

Parameter

Value or specification

PCB pad diameter

250

μm

Micro-via diameter

100

μm (0.004 inch)

Solder mask aperture diameter

325

μm

Copper thickness

20

μm to 40 μm

Copper finish

AuNi

PCB material

FR4

Table 12.

Assembly recommendations

Parameter

Value or specification

Solder screen aperture diameter

325

μm

Solder screen thickness

100

μm (0.004 inch)

Solder paste: Pb-free

SnAg (3 % to 4 %); Cu (0.5 % to 0.9 %)

Solder to flux ratio

50 : 50

Solder reflow profile

see Figure 15

The device is capable of withstanding at least three reflows of this profile.

Fig 15. Pb-free solder reflow profile

001aai943

250

230

217

T

(

°C)

cooling rate

preheat

t (s)