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DSA6371ML3JB-T Datasheet(PDF) 10 Page - Microchip Technology |
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DSA6371ML3JB-T Datasheet(HTML) 10 Page - Microchip Technology |
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10 / 26 page  DSA63XX DS20006189A-page 10 2019 Microchip Technology Inc. 5.0 SOLDER REFLOW PROFILE 60-180 Seconds 260°C 217°C 200°C 150°C 25°C 8 minutes max. Pre-Heat Reflow Cool Time 60-150 Seconds 20-40 Seconds FIGURE 5-1: Solder Reflow Profile. MSL 1 @ 260°C refer to JSTD-020C Ramp-Up Rate (200°C to Peak Temp) 3°C/sec. max. Preheat Time 150°C to 200°C 60 to 180 sec. Time maintained above 217°C 60 to 150 sec. Peak Temperature 255°C to 260°C Time within 5°C of actual Peak 20 to 40 sec. Ramp-Down Rate 6°C/sec. max. Time 25°C to Peak Temperature 8 minutes max. |
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