© 1995 Thinki Semiconductor Co., Ltd.

http://www.thinkisemi.com.tw/

Page 2/5

Rev.10T

APT30D40B

DYNAMIC CHARACTERISTICS

THERMAL AND MECHANICAL CHARACTERISTICS

Characteristic / Test Conditions

Junction-to-Case Thermal Resistance

Junction-to-Ambient Thermal Resistance

Package Weight

Maximum Mounting Torque

Symbol

W

T

Torque

MIN

TYP

MAX

.67

40

0.22

5.9

10

1.1

UNIT

°C/W

oz

g

lb•in

N•m

MIN

TYP

MAX

-

22

-

32

-

49

-

3

-

-

95

-

360

-

7

-

-

47

-

730

-

25

UNIT

ns

nC

Amps

ns

nC

Amps

ns

nC

Amps

Characteristic

Reverse Recovery Time

Reverse Recovery Time

Reverse Recovery Charge

Maximum Reverse Recovery Current

Reverse Recovery Time

Reverse Recovery Charge

Maximum Reverse Recovery Current

Reverse Recovery Time

Reverse Recovery Charge

Maximum Reverse Recovery Current

Symbol

t

rr

t

rr

Q

rr

I

RRM

t

rr

Q

rr

I

RRM

t

rr

Q

rr

I

RRM

Test Conditions

I

V

I

V

I

V

I

1.0

RECTANGULAR PULSE DURATION (seconds)

FIGURE 1a. MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs. PULSE DURATION

0.70

0.60

0.50

0.40

0.30

0.20

0.10

0

0.5

SINGLE PULSE

0.1

0.3

0.7

0.9

0.05

FIGURE 1b, TRANSIENT THERMAL IMPEDANCE MODEL

Peak TJ = PDM x ZθJC + TC

Duty Factor D =

t2

t1

Note:

0.289 °C/W

0.381 °C/W

0.00448 J/°C

0.120 J/°C

Power

(watts)

RC MODEL

Junction

temp(°C)

Case temperature(°C)