UBM

Ball pad

Solder mask

Package side

5

DLPC6540

www.ti.com

DLPS154 – APRIL 2020

Product Folder Links: DLPC6540

Submit Documentation Feedback

Copyright © 2020, Texas Instruments Incorporated

6.1 Package Data (Preliminary)

Table 1. Package Information

PARAMETER

VALUE

UNITS

Package type

P-HBGA

Number of balls

676

Number of balls (signal/thermal)

612 / 64

Ball pitch

1.00

mm

UBM (under bump metallurgy)

0.48 (See Figure 1)

mm

BPD (ball pad diameter)

0.58 (See Figure 1)

mm

Body dimension

See Mechanical Drawing

mm

Mold compound dimensions

See Mechanical Drawing

mm

Package volume class

350 - 2000 (J-STD-20D)

Approximate weight

5.64

g

Substrate circuit

Pb-free

Package balls

Pb-free

Solder paste

Pb-free

Solder profile

Moisture sensitivity level

MSL Level 3 (J-STD-20D)

Solder ball composition

SAC305

WIrebond

Cu

Mounting technique

a) Hot air reflow (including the combination of long and/or medium

infrared ray reflow)

b) Long or medium infrared ray reflow

Figure 1. Package Ball Parameters