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TVS Avalanche Diode in a Chip Scale Package

SP0501BACT

Printed Circuit Board Recommendations

Pad Size in PCB

14 x 6 mils (0.356 x 0.152mm)

Pad Shape

Rectangle

Pad Definition

Non Solder Mask Defined Pads (NSMD)

Solder Mask Opening

18 x 10 mils (0.457 x 0.254mm)

Solder Stencil Thickness

6 mils (0.152mm)

Solder Stencil Aperture Opening

14 x 6 mils (0356 x 0.152mm)

Solder Flux Ratio

50/50

Solder Paste Type

No Clean

Board Trace Finish

Organic Solderable Preservative (OSP)

(Enteck: Cu Plus 106A)

28 mils

14 mils 18 mils

10 mils

2 mils

Solder stencil

opening/PCB land

Solder Mask

Opening

6 mils

2 mils

TVS Diode Arrays

5

Typical Solder Reflow Thermal Profile (No-Clean Flux)

0

48

97

Time (s)

145

194

242

290

339

387

435

EXH

CD

RF

Z

Z4

Z3

Z2

PH

EXH

250

225

200

175

150

125

100

75

50

25