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LPC55S6X Datasheet(PDF) 102 Page - NXP Semiconductors

Part # LPC55S6X
Description  32-bit Arm Cortex짰-M33; M33 coprocessor, TrustZone, PowerQuad, CASPER, 320 KB SRAM; 640 KB flash, USB HS,Flexcomm Interface, SDIO, 32-bit counter/ timers,SCTimer/PWM, PLU, 16-bit 1.0 Msamples/sec ADC,Comparator, Temperature Sensor, AES, PUF, SHA, CRC, RNG
PDF  128 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

LPC55S6X Datasheet(HTML) 102 Page - NXP Semiconductors

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LPC55S6x
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2020. All rights reserved.
Product data sheet
Rev. 1.9 — 10 February 2020
102 of 128
NXP Semiconductors
LPC55S6x
32-bit ARM Cortex-M33 microcontroller
CX1 = CX2 = 2CL  (CPad + CParasitic)
Where:
CL - Crystal load capacitance
CPad - Pad capacitance of the XTAL32M_P and XTAL32M_N pins (~3 pF).
CParasitic – Parasitic or stray capacitance of external circuit.
Although CParasitic can be ignored in general, the actual board layout and placement of
external components influences the optimal values of external load capacitors. Therefore,
it is recommended to fine tune the values of external load capacitors on actual hardware
board to get the accurate clock frequency. For fine tuning, output the RTC Clock to one of
the GPIOs and optimize the values of external load capacitors for minimum frequency
deviation.
13.2.1 Crystal Printed Circuit Board (PCB) design guidelines
• Connect the crystal and external load capacitors on the PCB as close as possible to
the oscillator input and output pins of the chip.
• The length of traces in the oscillation circuit should be as short as possible and must
not cross other signal lines.
• Ensure that the load capacitors CX1, CX2, and CX3, in case of third overtone crystal
usage, have a common ground plane.
• Loops must be made as small as possible to minimize the noise coupled in through
the PCB and to keep the parasitics as small as possible.
• Lay out the ground (GND) pattern under crystal unit.
• Do not lay out other signal lines under crystal unit for multi-layered PCB.
13.3 RTC oscillator
In the RTC oscillator circuit, only the 32.768 kHz crystal (XTAL) and the capacitances CX1
and CX2 need to be connected externally on XTAL32K_P and XTAL32K_N. See
Figure 24.
In bypass mode, an external clock (maximum frequency of up to 100 kHz) can also be
connected to XTAL32K_P if XTAL32K_N is left open. External [0 – VH] square signal can
be applied on the XTAL32K_P pin with 1.1 V +/-10%
A external signal below 1.0 V or above 1.2 V cannot be applied



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