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LPC55S6X Datasheet(PDF) 127 Page - NXP Semiconductors |
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LPC55S6X Datasheet(HTML) 127 Page - NXP Semiconductors |
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127 / 128 page  LPC55S6x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2020. All rights reserved. Product data sheet Rev. 1.9 — 10 February 2020 127 of 128 NXP Semiconductors LPC55S6x 32-bit ARM Cortex-M33 microcontroller 7.30.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 7.30.2 Comparator. . . . . . . . . . . . . . . . . . . . . . . . . . . 65 7.30.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 7.30.3 Temperature sensor . . . . . . . . . . . . . . . . . . . . 66 7.31 Security Features . . . . . . . . . . . . . . . . . . . . . . 66 7.31.1 AES engine. . . . . . . . . . . . . . . . . . . . . . . . . . . 66 7.31.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 7.31.2 HASH engine . . . . . . . . . . . . . . . . . . . . . . . . . 66 7.31.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 7.31.3 PUF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 7.31.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 7.31.4 Random Number Generator . . . . . . . . . . . . . . 67 7.31.5 PRINCE On-the-fly encryption/decryption . . . 68 7.31.6 Universally Unique Identifier (UUID). . . . . . . . 68 7.32 Debug Mailbox and Authentication . . . . . . . . . 68 7.33 Emulation and debugging. . . . . . . . . . . . . . . . 68 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 69 9 Thermal characteristics . . . . . . . . . . . . . . . . . 71 10 Static characteristics. . . . . . . . . . . . . . . . . . . . 72 10.1 General operating conditions . . . . . . . . . . . . . 72 10.2 CoreMark data . . . . . . . . . . . . . . . . . . . . . . . . 73 10.3 Power consumption . . . . . . . . . . . . . . . . . . . . 74 10.3.1 Peripheral Power Consumption . . . . . . . . . . . 77 10.4 Pin characteristics . . . . . . . . . . . . . . . . . . . . . 80 11 Dynamic characteristics . . . . . . . . . . . . . . . . . 82 11.1 Flash memory. . . . . . . . . . . . . . . . . . . . . . . . . 82 11.2 I/O pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 11.3 Wake-up process . . . . . . . . . . . . . . . . . . . . . . 83 11.4 FRO (12 MHz/96 MHz). . . . . . . . . . . . . . . . . . 83 11.5 FRO (1 MHz) . . . . . . . . . . . . . . . . . . . . . . . . . 83 11.6 FRO (32 KHz). . . . . . . . . . . . . . . . . . . . . . . . . 84 11.7 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . . 84 11.8 I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 11.9 I2S-bus interface . . . . . . . . . . . . . . . . . . . . . . . 86 11.10 SPI interface (Flexcomm Interfaces 0 - 7) . . . 88 11.11 High-Speed SPI interface (Flexcomm Interface 8) 91 11.12 USART interface. . . . . . . . . . . . . . . . . . . . . . . 94 11.13 SD/MMC and SDIO . . . . . . . . . . . . . . . . . . . . 95 12 Analog characteristics . . . . . . . . . . . . . . . . . . 96 12.1 BODVBAT. . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 12.2 16-bit ADC characteristics . . . . . . . . . . . . . . . 98 12.2.1 ADC input resistance . . . . . . . . . . . . . . . . . . . 99 12.2.2 Temperature sensor . . . . . . . . . . . . . . . . . . . . 99 12.2.3 Comparator. . . . . . . . . . . . . . . . . . . . . . . . . . . 99 13 Application information . . . . . . . . . . . . . . . . 101 13.1 I/O power consumption. . . . . . . . . . . . . . . . . 101 13.2 Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . 101 13.2.1 Crystal Printed Circuit Board (PCB) design guidelines 102 13.3 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 102 13.3.1 RTC Printed Circuit Board (PCB) design guidelines 103 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . 104 15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . 121 17 Revision history. . . . . . . . . . . . . . . . . . . . . . . 122 18 Legal information. . . . . . . . . . . . . . . . . . . . . . 124 18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . 124 |
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