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TLV9301, TLV9302, TLV9304

SBOS941B – FEBRUARY 2019 – REVISED MARCH 2020

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Product Folder Links: TLV9301 TLV9302 TLV9304

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Copyright © 2019–2020, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 5

6.1

Absolute Maximum Ratings ...................................... 5

6.2

ESD Ratings.............................................................. 5

6.3

Recommended Operating Conditions ....................... 5

6.4

Thermal Information for Single Channel ................... 5

6.5

Thermal Information for Dual Channel...................... 6

6.6

Thermal Information for Quad Channel .................... 6

6.7

Electrical Characteristics........................................... 7

6.8

Typical Characteristics ............................................ 10

7

Detailed Description ............................................ 17

7.1

Overview ................................................................. 17

7.2

Functional Block Diagram ....................................... 17

7.3

Feature Description................................................. 18

7.4

Device Functional Modes........................................ 25

8

Application and Implementation ........................ 26

8.1

Application Information............................................ 26

8.2

Typical Applications ................................................ 26

9

Power Supply Recommendations ...................... 28

10

Layout................................................................... 28

10.1

Layout Guidelines ................................................. 28

10.2

Layout Example .................................................... 28

11

Device and Documentation Support ................. 31

11.1

Device Support...................................................... 31

11.2

Documentation Support ........................................ 31

11.3

Related Links ........................................................ 31

11.4

Receiving Notification of Documentation Updates 32

11.5

Support Resources ............................................... 32

11.6

Trademarks ........................................................... 32

11.7

Electrostatic Discharge Caution ............................ 32

11.8

Glossary ................................................................ 32

12

Mechanical, Packaging, and Orderable

Information ........................................................... 33

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (April 2019) to Revision B

Page

•

Changed the TLV9301 and TLV9304 device statuses from Advance Information to Production Data ................................. 1

•

Removed preview notation from TLV9301 SOT-23 (5) package from Device Information table ........................................... 1

•

Removed preview notation from TLV9301 SC70 (5) package from Device Information table............................................... 1

•

Removed preview notation from TLV9304 SOIC (14) package from Device Information table............................................. 1

•

Removed preview notation from TLV9304 TSSOP (14) package from Device Information table ......................................... 1

•

Removed preview notation from TLV9301 DBV package (SOT-23) in the Pin Configuration and Functions section ........... 3

•

Removed preview notation from TLV9301 DCK package (SC70) in the Pin Configuration and Functions section .............. 3

•

Removed preview notation from TLV9304 D (SOIC) and TSSOP (PW) packages in the Pin Configuration and

Functions section.................................................................................................................................................................... 4

Changes from Original (February 2019) to Revision A

Page

•

Changed the TLV9302 device status from Advance Information to Production Data ............................................................ 1

•

Removed preview notation from TLV9302 SOIC (8) package from Device Information table............................................... 1

•

Removed preview notation from TLV9302 SOIC (8) package from Device Information table............................................... 1