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EXS00A-CS08664 Datasheet(PDF) 39 Page - Microchip Technology |
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EXS00A-CS08664 Datasheet(HTML) 39 Page - Microchip Technology |
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39 / 46 page ![]() Figure 10-2. System-On-Module Land Pattern Pads : Body : Pads Pitch : 176 40 x 38 x 2.80 0.8 A11 SAMA5D27-SOM1_POD 02/05/2017 SAMA5D27-SOM1 DIMENSIONS Drawn by : RC R LAND PATTERN RECOMMENDATIONS PIN 1 CORNER S1 W k L Inside <S1-S2> square, keepout area No vias, no tracks, no copper are allowed. Units: mm Table 10-2. System-On-Module Land Pattern Dimensions Symbol Common Dimensions Comments Min. Typ. Max. Land Pattern Pad Width W – 0.600 – Solder Mask Defined 0.550 Land Pattern Pad Length L – 2.000 – – Land Pattern Pad X Space S1 – 37.000 – – Land Pattern Pad Y Space S2 – 35.000 – – Land Pattern Pad Space k – 0.200 – – SAMA5D27 SOM1 © 2017 Microchip Technology Inc. Datasheet DS60001521A-page 39 |
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