LIS2DW12 datasheet(19/66 Pages) STMICROELECTRONICS

19 / 66 page

Application hints

Figure 6. LIS2DW12 electrical connections (top view)

SDA/SDI/SDO

SCL/SPC

10µF

100nF

GND

SDO/SA0

LIS2DW12

HOST

I2C / SPI (3/4-w)

SCL

SDA

Vdd_IO

Rpu

Pull-up to be added

Rpu=10kOhm

I2C configuration

Vdd_IO

100nF

GND

VDD

Vdd

RES

GND

The device core is supplied through the Vdd line while the I/O pads are supplied through the Vdd_IO line. Power

supply decoupling capacitors (100 nF ceramic, 10 µF aluminum) should be placed as near as possible to pin 9 of

the device (common design practice).

All the voltage and ground supplies must be present at the same time to have proper behavior of the IC (refer to

Figure 6. LIS2DW12 electrical connections (top view)). It is possible to remove Vdd while maintaining Vdd_IO

without blocking the communication bus, in this condition the measurement chain is powered off.

The functionality of the device and the measured acceleration data are selectable and accessible through the I²C

or SPI interfaces. When using the I²C, CS must be tied high (i.e. connected to Vdd_IO).

The functions, the threshold and the timing of the two interrupt pins (INT1 and INT2) can be completely

programmed by the user through the I²C/SPI interface.

LIS2DW12

Application hints

DS11811 - Rev 8

page 19/66

LIS2DW12 Datasheet(PDF) 19 Page - STMicroelectronics