MXT1664T3-ABESSQTP datasheet(83/98 Pages) MICROCHIP

83 / 98 page

MXT1664T3 2.0

 2018 Microchip Technology Inc.

DS40002054A-page 83

14.13 Touch Accuracy and Repeatability

14.14 Thermal Packaging

14.14.1

THERMAL DATA

14.14.2

JUNCTION TEMPERATURE

The maximum junction temperature allowed on this device is 125

C.

The average junction temperature in

C (T

J) for this device can be obtained from the following:

If a cooling device is required, use this equation:

where:

•



JA= package thermal resistance, Junction to ambient (C/W) (see Section 14.14.1 “Thermal Data”)

•



JC = package thermal resistance, Junction to case thermal resistance (C/W) (see Section 14.14.1 “Thermal

Data”)

•



HEATSINK = cooling device thermal resistance (C/W), provided in the cooling device datasheet

•PD = device power consumption (W)

•TA is the ambient temperature (C)

14.15 ESD Information

Parameter

Min

Typ

Max

Units

Notes

Linearity (touch only; 5.4 mm electrode

pitch)

–

±1

–

8 mm or greater finger

Linearity (touch only; 4.2 mm electrode

pitch)

–

±0.5

–

4 mm or greater finger

Accuracy

–±1–

Accuracy at edge

–

±2

–

Repeatability

–

±0.25

–

X axis with 12-bit resolution

Parameter

Description

Typ

Unit

Condition

Package



Junction to ambient thermal

resistance

42.1

C/W

Still air

136-ball UFBGA 7 × 7 × 0.6 mm



Junction to case thermal

resistance

6.2

C/W

136-ball UFBGA 7 × 7 × 0.6 mm



Junction to ambient thermal

resistance

28.2

C/W

Still air

162-ball UFBGA 10 × 5 × 0.6 mm



Junction to case thermal

resistance

2.4

C/W

162-ball UFBGA 10 × 5 × 0.6 mm









HEATSINK









Parameter

Value

Reference standard

Human Body Model (HBM)

±2000 V

JEDEC JS–001

Charge Device Model (CDM)

±250 V

JEDEC JS–001

MXT1664T3-ABESSQTP Datasheet(PDF) 83 Page - Microchip Technology

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