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FT232RL Datasheet(PDF) 33 Page - Future Technology Devices International Ltd.

Part # FT232RL
Description  Single chip USB to asynchronous serial data transfer interface
PDF  40 Pages
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Manufacturer  FTDI [Future Technology Devices International Ltd.]
Direct Link  http://www.ftdichip.com
Logo FTDI - Future Technology Devices International Ltd.

FT232RL Datasheet(HTML) 33 Page - Future Technology Devices International Ltd.

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Copyright © Future Technology Devices International Limited
33
FT232R USB UART IC Datasheet
Version 2.16
Document No.: FT_000053 Clearance No.: FTDI# 38
9.3 Solder Reflow Profile
The FT232R is supplied in Pb free 28 LD SSOP and QFN-32 packages. The recommended solder reflow
profile for both package options is shown in Figure 9.3.
Figure 9.3 FT232R Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 9.1. Values are shown for both
a completely Pb free solder process (i.e. the FT232R is used with Pb free solder), and for a non-Pb free
solder process (i.e. the FT232R is used with non-Pb free solder).
Profile Feature
Pb Free Solder
Process
Non-Pb Free Solder Process
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
150°C
200°C
60 to 120 seconds
100°C
150°C
60 to 120 seconds
Time Maintained Above Critical
Temperature TL:
- Temperature (TL)
- Time (tL)
217°C
60 to 150 seconds
183°C
60 to 150 seconds
Peak Temperature (Tp)
260°C
240°C
Time within 5°C of actual Peak
Temperature (tp)
20 to 40 seconds
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
6°C / second Max.
Time for T= 25°C to Peak
Temperature, Tp
8 minutes Max.
6 minutes Max.
Table 9.1 Reflow Profile Parameter Values
Critical Zone: when
T is in the range
T to T
Time, t (seconds)
25
P
T = 25º C to T
tp
Tp
TL
t
Preheat
S
t
L
Ramp Up
L
p
Ramp
Down
T Max
S
T Min
S



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