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MSP430F5632IPZ Datasheet(PDF) 49 Page - Texas Instruments |
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MSP430F5632IPZ Datasheet(HTML) 49 Page - Texas Instruments |
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49 / 127 page ![]() 8.45 12-Bit DAC, Reference Input Specifications over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT VeREF+ Reference input voltage range DAC12IR = 0(1) (2) 2.2 V, 3 V AVCC / 3 AVCC + 0.2 V DAC12IR = 1(3) (4) AVCC AVCC + 0.2 Ri(VREF+), Ri(VeREF+) Reference input resistance DAC12_0 IR = DAC12_1 IR = 0 2.2 V, 3 V 20 MΩ DAC12_0 IR = 1, DAC12_1 IR = 0 48 kΩ DAC12_0 IR = 0, DAC12_1 IR = 1 48 DAC12_0 IR = DAC12_1 IR = 1, DAC12_0 SREFx = DAC12_1 SREFx(5) 24 (1) For a full-scale output, the reference input voltage can be as high as 1/3 of the maximum output voltage swing (AVCC). (2) The maximum voltage applied at reference input voltage terminal VeREF+ = (AVCC – VE(O)) / (3 × (1 + EG)). (3) For a full-scale output, the reference input voltage can be as high as the maximum output voltage swing (AVCC). (4) The maximum voltage applied at reference input voltage terminal VeREF+ = (AVCC – VE(O)) / (1 + EG). (5) When DAC12IR = 1 and DAC12SREFx = 0 or 1 for both channels, the reference input resistive dividers for each DAC are in parallel reducing the reference input resistance. 8.46 12-Bit DAC, Dynamic Specifications VREF = VCC, DAC12IR = 1 (see Figure 8-19 and Figure 8-20), over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT tON DAC12 on time DAC12_xDAT = 800h, ErrorV(O) < ±0.5 LSB(1) (see Figure 8-19) DAC12AMPx = 0 → {2, 3, 4} 2.2 V, 3 V 60 120 µs DAC12AMPx = 0 → {5, 6} 15 30 DAC12AMPx = 0 → 7 6 12 tS(FS) Settling time, full scale DAC12_xDAT = 80h → F7Fh → 80h DAC12AMPx = 2 2.2 V, 3 V 100 200 µs DAC12AMPx = 3, 5 40 80 DAC12AMPx = 4, 6, 7 15 30 tS(C-C) Settling time, code to code DAC12_xDAT = 3F8h → 408h → 3F8h, BF8h → C08h → BF8h DAC12AMPx = 2 2.2 V, 3 V 5 µs DAC12AMPx = 3, 5 2 DAC12AMPx = 4, 6, 7 1 SR Slew rate DAC12_xDAT = 80h → F7Fh → 80h(2) DAC12AMPx = 2 2.2 V, 3 V 0.05 0.35 V/µs DAC12AMPx = 3, 5 0.35 1.10 DAC12AMPx = 4, 6, 7 1.50 5.20 Glitch energy DAC12_xDAT = 800h → 7FFh → 800h DAC12AMPx = 7 2.2 V, 3 V 35 nV-s (1) RLoad and CLoad connected to AVSS (not AVCC/2) in Figure 8-19. (2) Slew rate applies to output voltage steps ≥ 200 mV. R = 3 k Load W AV CC C = 100 pF Load 2 DAC Output R O/P(DAC12.x) I Load Conversion 1 Conversion 2 V OUT Conversion 3 Glitch Energy ±1/2 LSB ±1/2 LSB t settleLH t settleHL Figure 8-19. Settling Time and Glitch Energy Testing www.ti.com MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635 MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630 SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 49 Product Folder Links: MSP430F5638 MSP430F5637 MSP430F5636 MSP430F5635 MSP430F5634 MSP430F5633 MSP430F5632 MSP430F5631 MSP430F5630 |
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