0

0

Time (sec)

30

60

90

120

150

180

210

240

270

300

25

50

75

100

125

150

175

200

225

250

Note 21: Temperatures are taken and monitored at the component copper layer.

Note 22: Optimum profile may differ due to oven type, circuit board or assembly layout.

Note 23: Recommended lead free, no-clean solder: AIM NC254-SAC305.

Note 24: Refer to APN-001473 soldering and handling application note for additional solder profiles and details.

Note 25: MSL- Level 2A

Solder Profile

13

PDS-002760 Rev 01

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SST-90-R Product Datasheet

Lead free solder guideline for low density boards

Solder Profile Stage

Lead-Free Solder

Lead-based Solder

Profile length, Ambient to Peak

2.75 - 3.5 minutes

2.75 - 3.5 minutes

Time Maintained Above: Temperature

217 ºC

183 ºC

Time Maintained Above: Time

30 - 60 seconds

30 - 60 seconds

Cooldown Rate

≤4º C/sec

≤4º C/sec

Cooldown Duration

45 ± 15 sec

45 ± 15 sec

SAC 305 Reflow Profile Window For Low Density Boards