Express-CF/CFE

Features

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PICMG COM.0 R3.0 Type 6 module with hexacore and quad-core

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Up to 48GB Dual Channel DDR4 at 2133/2400MHz

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Three DDI channels, one LVDS (or 4 lanes eDP), supports up to

3 independent displays

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One PCIe x16 Gen3, eight PCIe x1 Gen3 (NVMe SSD &

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GbE, four SATA 6 Gb/s, four USB 3.1 and four USB 2.0

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Supports Smart Embedded Management Agent (SEMA) functions

Specifications

CPU

• Core™ i7-8850H, 2.6 (4.3)GHz, 9MB, 45W (35W cTDP), 6C/GT2

• Core™ i5-8400H, 2.5 (4.2)GHz, 8MB, 45W (35W cTDP), 4C/GT2

• Core™ i3-8100H, 3.0GHz, 6MB, 45W (35W cTDP), 4C/GT2

Note: Availability of the features may vary between processor SKUs.

Memory

2133/2400 MHz DDR4 memory up to 48GB in three SODIMM sockets

(48GB is build support)

Embedded BIOS

Cache

6MB for Core™ i3

Chipset

Expansion Busses

• PCIe x16, 2 PCIe x8, or 1 PCIe x8 with 2 PCIe x4 (Gen3)

• 6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5

• 2 PCI Express x1 (Gen3); CD connector, Lane 6/7

SEMA Board Controller

Supports: voltage/current monitoring, power sequence debug support,

AT/ATX mode control, logistics and forensic information, flat panel control,

control

Debug Headers

• 40-pin multipurpose flat cable connector for use with DB-40 debug module

providing BIOS POST code LED, BMC access, SPI BIOS flashing, power

testpoints, debug LEDs

• 60-pin XDP header for ICE debug of CPU/chipset

GPU Feature Support

and simultaneous display combinations of DisplayPort/HDMI (or VGA), LVDS

or eDP outputs

• Hardware encode/transcode HD content (including HEVC 10-bit)

• DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1,

DirectX 10,DirectX 9 support

• OpenGL 4.5 support

• OpenCL 2.1, 2.0/1.2 support

Digital Display Interface

DDI1/2/3 supporting DisplayPort 1.2, HDMI 1.4, DVI

Notes:

DP1.2: max. resolution is 4096x2304 @ 60Hz, 24bpp

HDMI1.4: max. resolution is 4096x2160 @ 24Hz, 24bpp

VGA

VGA support, in place of DDI3 channel (build option, max. resolution

1920x1200@60Hz)

LVDS

Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution

1920x1200@60Hz in dual mode)

eDP

4 lane support optional, in place of LVDS (build option, max. resolution

4096x2304 @60Hz, 24bpp)

Audio Codec:located on carrier Express-BASE6 (ALC886 standard supported)

Interface: 10/100/1000 GbE connection

Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.

Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.