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XG5 Datasheet(PDF) 2 Page - Toshiba Semiconductor |
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XG5 Datasheet(HTML) 2 Page - Toshiba Semiconductor |
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2 / 13 page ![]() 2 / 13 Copyright © 2017 Toshiba Memory Corporation. All rights reserved. Client SSD XG5 Series Brochure Rev.1.00 Products and specifications discussed herein are for reference purposes only and are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating and producing designs and using, customers must refer to and comply with the latest versions of the product specifications. Note: 1) Definition of capacity: Toshiba defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 230 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary. 2) 1 MiB (mebibyte) = 220 bytes = 1,048,576 bytes, and 1 MB (megabyte) = 1,000,000 bytes. 3) MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF. * PCIe® and PCI Express® are registered trademarks of PCI-SIG * NVMeTM and NVM ExpressTM are trademarks of NVM Express, Inc. * Product image may represent a design model. * Read and write speed may vary depending on the host device, read and write conditions, and file size. Standard Models M.2 2280-S2 (Single-sided) Temperature Operating 0 to 95 °C (Controller Temperature) 0 to 85 °C (Other Components Temperature) Non- operating -40 to 85 °C Reliability3) Mean Time to Failure (MTTF): 1,500,000 hours Product Life: Approximately 5 years More Features • Device Self-test is supported. • Host Controlled Thermal Management (HCTM) is supported. • Strong & highly-efficient ECC named QSBCTM is supported. • TCG Pyrite Version 1.00 is supported. • Storage Interface Interactions Specification(SIIS) Version 1.06 is supported. Compliance UL, cUL, TÜV, KC, FCC, BSMI, CE, RCM, IC, VCCI |
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