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ST33TPHF2ESPI Datasheet(PDF) 14 Page - STMicroelectronics

Part # ST33TPHF2ESPI
Description  Flash-memory-based device combining TPM 1.2 and TPM 2.0 with an SPI interface
PDF  26 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST33TPHF2ESPI Datasheet(HTML) 14 Page - STMicroelectronics

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6
Delivery packing
Surface-mount packages can be supplied with tape and reel packing. The reels have a 13" typical diameter.
Reels are in plastic, either anti-static or conductive, with a black conductive cavity tape. The cover tape is
transparent anti-static or conductive.
The devices are positioned in the cavities with the identifying pin (normally Pin “1”) on the same side as the
sprocket holes in the tape.
The STMicroelectronics tape and reel specifications are compliant to the EIA 481-A standard specification.
Table 5. Packages on tape and reel
Package
Description
Tape width
Tape pitch
Reel diameter
Quantity per reel
TSSOP 28
Thin shrink small outline package
16 mm
8 mm
13 in.
2500
VFQFPN 32
Very thin fine pitch quad flat pack no-lead package
12 mm
8 mm
13 in.
3000
Figure 9. Reel diagram
A
D
B
C
N
T
G
Table 6. Reel dimensions
Reel size
Tape width
A Max.
B Min.
C
D Min.
G Max.
N Min.
T Max.
Unit
13”
16
330
1.5
13 ±0.2
20.2
16.4 +2/–0
100
22.4
mm
12
12.6
18.4
ST33TPHF2ESPI
Delivery packing
DB2716 - Rev 4
page 14/26



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