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EXPRESS-SL Datasheet(PDF) 1 Page - Adlink Technology Inc. |
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EXPRESS-SL Datasheet(HTML) 1 Page - Adlink Technology Inc. |
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1 / 4 page ![]() Express-SL/SLE COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Intel® Xeon® and Celeron® Processor Features ● 6th Gen Intel® Core™, Intel® Xeon® and Celeron® Processor ● Up to 32 GB Dual Channel DDR4 at 1867/2133 MHz (supports both ECC and non-ECC memory) ● 3x DDI channels, 1x LVDS (or 4 lanes eDP) supports up to 3 independent displays ● 8x PCIe x1 (Gen3) and 1x PCIe x16 (Gen3) ● GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0 ● Supports Smart Embedded Management Agent (SEMA®) functions ● Extreme Rugged operating temperature: -40°C to +85°C (build option) New Specifications ● Core System CPU Mobile Intel® Xeon®, Core™ and Celeron® Processors - 14nm Xeon® E3-1515M v5 2.8/3.7GHz (Turbo), 45W (4C/GT4e) Xeon® E3-1505M v5 2.8/3.7GHz (Turbo), 45W (4C/GT2) Xeon® E3-1505L v5 2.0/2.8GHz (Turbo), 25W (4C/GT2) Core™ i7-6820EQ 2.8/3.5GHz (Turbo), 45W (4C/GT2) Core™ i7-6822EQ 2.0/2.8GHz (Turbo), 25W (4C/GT2) Core™ i5-6440EQ 2.7/3.4GHz (Turbo), 45W (4C/GT2) Core™ i5-6442EQ 1.9/2.7GHz (Turbo), 25W (4C/GT2) Core™ i3-6100E 2.7GHz (no Turbo), 35W (2C/GT2) Core™ i3-6102E 1.9GHz (no Turbo), 25W (2C/GT2) Celeron® G3900E 2.4GHz (no Turbo), 35W (2C/GT1) Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX. Note: Availability of the features may vary between processor SKUs. Memory Dual channel 1867/2133 MHz DDR4 memory up to 32GB in dual SODIMM sockets (ECC/non-ECC support dependent on selected CPU/PCH) Embedded BIOS AMI EFI with CMOS backup in 16MB SPI BIOS with Intel® AMT 11.0 support Cache 8MB for Xeon® and Core™ i7, 6MB for Core™ i5, 3MB for Core™ i3, 2MB for Celeron® PCH CM236 (supports ECC memory, Intel® AMT) QM170 (supports non-ECC, Intel® AMT) HM170 (supports non-ECC, no Intel® AMT support) Expansion Busses PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3) 6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5 2 PCI Express x2 (Gen3): CD connector, Lanes 6/7 LPC bus, SMBus (system) , I2C (user) Debug Headers 40-pin flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs 60-pin XDP header for ICE debug of CPU/chipset ● Video GPU Feature Support Intel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP outputs Hardware encode/transcode HD content (including HEVC) DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 4.4/4.3 and ES 2.0 support OpenCL 2.1, 2.0/1.2 support Digital Display Interface DDI1/2/3 supporting DisplayPort/HDMI/DVI LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC eDP 4 lane support optional, in place of LVDS ● Audio Chipset Intel® HD Audio integrated in chipset Audio Codec located on carrier Express-BASE6 (ALC886 standard supported) ● Ethernet Intel® MAC/PHY: i219LM/V (LM with AMT 11.0 support) Interface: 10/100/1000 GbE connection Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times. |
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