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LP5907 Datasheet(PDF) 32 Page - Texas Instruments |
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LP5907 Datasheet(HTML) 32 Page - Texas Instruments |
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32 / 47 page ![]() www.ti.com PACKAGE OUTLINE C 0.35 0.35 4X 0.20 0.16 0.33 MAX 0.12 0.09 0.175 0.175 B E A D DSBGA - 0.33mm MAX HEIGHT YKG0004 DIE SIZE BALL GRID ARRAY 4218366/E 05/2020 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 0.05 C 0.015 C A B 2 1 A B BUMP SEATING PLANE SCALE 15.000 BUMP A1 CORNER D: Max = E: Max = 0.675 mm, Min = 0.675 mm, Min = 0.615 mm 0.615 mm |
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