© 1998 IXYS All rights reserved

C2 - 14

Symbol Test Conditions

Characteristic Values

(T

Min. Typ.

Max.

V

DSS

V

200

V

V

GS(th)

V

2.0

4.0

V

I

GSS

V

±100

nA

I

DSS

V

T

500

µA

V

T

3

mA

R

DS(on)

V

35 mΩ

Pulse test, t ≤ 300 ms, duty cycle d ≤ 2%

TO-247AD (IXTH)

Features

• Low R

TM

process

• Rugged polysilicon gate cell structure

• International standard package

• Fast switching times

Applications

• Motor controls

• DC choppers

• Uninterruptable Power Supplies (UPS)

• Switch-mode and resonant-mode

Advantages

• Easy to mount with one screw

(isolated mounting screw hole)

• Space savings

• High power density

95512C (12/97)

High Current

N-Channel Enhancement Mode

IXYS reserves the right to change limits, test conditions and dimensions.

Preliminary data

Symbol

Test conditions

Maximum ratings

V

DSS

T

J

= 25°C to 150°C

200

V

V

DGR

T

J

= 25°C to 150°C; R

200

V

V

GS

Continuous

±20

V

V

GSM

Transient

±30

V

I

D25

T

C

= 25°C

74N20

74

A

68N20

68

A

I

DM

T

C

= 25°C, pulse width limited by T

JM

74N20

296

A

68N20

272

A

P

D

T

C

= 25°C

74N20

416

W

68N20

300

W

T

J

-55 ... +150

°C

T

JM

150

°C

T

stg

-55 ... +150

°C

M

d

Mounting torque

1.13/10

Nm/lb.in.

Weight

TO-264

10

g

TO-247

6

g

Max lead temperature for soldering

300

°C

1.6 mm (0.062 in.) from case for 10 s

D (TAB)

V

DSS

I

D25

R

DS(on)

IXTK 74 N20

200 V 74 A 35 mW

IXTH 68 N20

200 V 68 A 35 mW

TO-264 AA (IXTK)

S

G

D

D (TAB)

G = Gate

D

= Drain

S = Source

Tab = Drain