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TPCF8104 Datasheet(PDF) 2 Page - Toshiba Semiconductor

Part # TPCF8104
Description  TOSHIBA FIELD EFFECT TRANSISTOR SILICON P CHANNEL MOS TYPE(U-MOS4)
PDF  3 Pages
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Manufacturer  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TPCF8104 Datasheet(HTML) 2 Page - Toshiba Semiconductor

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TOSHIBA
TPCF8104
ELECTRICAL CHARACTERISTICS(Ta=25℃)
CHARACTERISTICS
SYMBOL
TEST CONDITION
MIN.
TYP.
MAX.
UNIT
Gate Leakage Current
IGSS
VGS=±16V,VDS=0V
−
−
±10
μA
Drain Cut-off Current
IDSS
VDS=-30V,VGS=0V
−
−
-10
μA
V(BR)DSS
ID=-10mA,VGS=0V
-30
−
−
V
Drain-Source Breakdown
Voltage
V(BR)DSX
ID=-10mA,VGS=20V
-15
−
−
V
Gate Threshold Voltage
Vth
VDS=-10V,ID=-1mA
-0.8
−
-2.0
V
Drain-Source ON Resistance
RDS(ON)
VGS=-4.5V,ID=3A
−
37
46
mΩ
VGS=-10V,ID=-3A
−
26
33
Forward Transfer Admittance
│Yfs│
VDS=-10V,ID=-3A
TBD
TBD
−
S
Input Capacitance
Ciss
−
TBD
−
Reverse Transfer Capacitance
Crss
−
TBD
−
Output Capacitance
Coss
VDS=-10V,VGS=0V
f=1MHz
−
TBD
−
pF
Rise Time
tr
−
TBD
−
Turn-on Time
ton
−
TBD
−
Fall Time
tf
−
TBD
−
Switching
Time
Turn-off Time
toff
−
TBD
−
ns
Total Gate Charge (Gate-Source
Plus Gate-Drain)
Qg
−
TBD
−
Gate-Source Charge
Qgs
−
TBD
−
Gate-Drain(“Miller”)Charge
Qgd
VDD≒-24V,VGS=-10V
ID=-6A
−
TBD
−
nC
SOURCE - DRAIN DIODE RATINGS AND CHARACTERISTICS(Ta=25℃)
CHARACTERISTICS
SYMBOL
TEST CONDITION
MIN.
TYP.
MAX.
UNIT
Pulse Drain Reverse Current
(Note1)
IDRP
−
−
−
-24
A
Diode Forward Voltage
VDSF
IDR=-6A,VGS=0V
−
−
1.2
V
Note1
Please use devices on condition that the channel temperature is below 150℃.
Note2:
(a) Device mounted on glass-epoxy board (a)
(b) Device mounted on glass-epoxy board (b)
FR-4
FR-4
25.4×25.4×0.8
25.4×25.4×0.8
(Unit in mm)
(Unit in mm)
(a)
(b)
Note3:
VDD=-24V, Tch=25℃(initial), L=0.5mH, RG=25Ω, IAR=-3.0A
Note4:
Repetitive rating ; Pulse Width Limited by Max. Channel Temperature.
RL=5Ω
VOUT
VDD≒-15V
ID=-3.0A
0V
VGS
-10V
Duty≦1%,tw=10us
4.7Ω
Tentative
Tentative
Tentative
Tentative



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