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PR5021 Datasheet(PDF) 7 Page - PREMA Semiconductor. |
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PR5021 Datasheet(HTML) 7 Page - PREMA Semiconductor. |
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7 / 8 page  Photodiode PR5020/21 Package Information SOLDERING INFORMATION A lead-free solder profile with a peak temper- ature of 260°C or less, according to J-STD-020 should be followed. Parts should be handled in accordance with the moisture sensitivity level as indicated on the moisture barrier bag, but at least to MSL 3. Any parts without or with unsealed moisture barrier bag must be dry-baked according to JEDEC guidelines before soldering. Manual soldering must be done with utmost care. Direct infrared heating should be avoided; pure convection heating is recommended. TAPE & REEL Reel diameter: 7“ (178 mm) Tape width: 8 mm Quantity per reel: 3,000 Packaging: moisture barrier bag Orientation of ICs in tape: Pins 3 and 4 towards sprocket holes BARE DIES PR5010 is available as bare dies on request on tested and sawn wafers or in wafflepack. Please contact us for minimum order quantities and delivery times. © PREMA Semiconductor GmbH 2018 I rev. 5119 Page 7/8 |
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