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STLQ020J30R Datasheet(PDF) 14 Page - STMicroelectronics

Part # STLQ020J30R
Description  200 mA ultra-low quiescent current LDO
PDF  31 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STLQ020J30R Datasheet(HTML) 14 Page - STMicroelectronics

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The PCB copper area acts as a heat sink. The footprint copper pads should be as wider as possible to spread
and dissipate the heat to the surrounding environment. Thermal vias to the inner or backside copper layers
improve the overall thermal performance of the device.
The power dissipation of the LDO depends on the input voltage, output voltage and output current, and is given
by:
Equation 2
PD = (VIN -VOUT) IOUT
The junction temperature of the device is:
Equation 3
TJ_MAX = TA + RthJA x PD
where: TJ_MAX is the maximum junction of the die, 125 °C; TA is the ambient temperature; RthJA is the thermal
resistance junction-to-ambient.
With the above equation it is possible to calculate the maximum allowable power dissipation, therefore the
maximum load current for a certain voltage drop. Appropriate de-rating of the operating condition can be applied
accordingly.
7.5
Protection features
Current limit
The STLQ020 embeds a constant-current limit circuit, which acts in case of overload or short-circuit on the output,
clamping the load current to a safe value (typ. 380 mA).
Normal operation is restored if the overload disappears, but prolonged operation in current limit may lead to high
power dissipation inside the LDO and subsequently to thermal shutdown.
Thermal protection
An internal thermal feedback loop disables the output voltage if the die temperature reaches approximately
160 °C. This feature protects the device from excessive temperature that could lead to permanent damage to the
LDO.
Once the thermal protection is triggered and the device is shut down, normal operation is automatically recovered
if the die temperature falls below 140 °C (thermal protection hysteresis of 20 °C typically)
Important note: to keep the device power consumption below 500 nA in low load/no load condition, the internal
thermal protection is kept disabled for load current below 1 mA.
Current and thermal limit protections are designed to protect the LDO from excessive power dissipation and not
intended to replace a proper thermal and electrical design of the application.
Continuous operation above the maximum ratings may lead to permanent damage to the device.
STLQ020
Protection features
DS12072 - Rev 3
page 14/31



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