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STM32L021D4 Datasheet(PDF) 109 Page - STMicroelectronics |
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STM32L021D4 Datasheet(HTML) 109 Page - STMicroelectronics |
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109 / 114 page  DocID027982 Rev 5 109/114 STM32L021x4 Package information 110 Figure 46. Thermal resistance 1. The above curves are valid for range 3. 7.7.1 Reference document JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air). Available from www.jedec.org. Table 72. Thermal characteristics Symbol Parameter Value Unit ΘJA Thermal resistance junction-ambient LQFP32 - 7 x 7 mm / 0.8 mm pitch 60 °C/W Thermal resistance junction-ambient UFQFPN32 - 5 x 5 mm / 0.5 mm pitch 39 Thermal resistance junction-ambient UFQFPN28 - 4 x 4 mm, 0.5 mm pitch 97 Thermal resistance junction-ambient UFQFPN20 - 3 x 3 mm, 0.5 mm pitch 102 Thermal resistance junction-ambient TSSOP20 - 169 mils 74 Thermal resistance junction-ambient TSSOP14 - 169 mils 95 |
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