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2158 Datasheet(PDF) 4 Page - 3M Electronics |
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2158 Datasheet(HTML) 4 Page - 3M Electronics |
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4 / 9 page  3M™ Scotch-Weld™ Epoxy Adhesive 2158 B/A Electrical and Thermal Properties (continued) Property Values Test Condition Notes Method Dissipation Factor 0.019 1 KHz, Room Temperature ASTM D150 Thermal Conductivity 0.283 (btu-ft)/(h- ft²-°F) Volume Resistivity 1.4 × 10^15 Ω-cm Room Temperature ASTM D257 Coe cient of Thermal Expansion 53 × 10^-6 m/m/ °C @ -50 to 30°C Coe cient of Thermal Expansion 135 × 10^-6 m/m/°C @ 70 to 130°C Typical Performance Characteristics T-Peel Adhesion: 3 lb/in width Conditions Dwell/Cure Time: 7 Dwell Time Units: day Temp C: 23C Temp F: 73F Substrate: FPL Etched Aluminum Methods ASTM D1876 Additional Information Notes: 2 psi applied during dwell |
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