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INA821 Datasheet(PDF) 25 Page - Texas Instruments

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Part # INA821
Description  INA849 Ultra-Low-Noise (1 nV/?숰z), High-Bandwidth, Instrumentation Amplifier
PDF  36 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

INA821 Datasheet(HTML) 25 Page - Texas Instruments

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10 Power Supply Recommendations
The nominal performance of the INA849 is specified with a supply voltage of ±15 V and midsupply reference
voltage. The device also operates using power supplies from ±4 V (8 V) to ±18 V (36 V) and non-midsupply
reference voltages with excellent performance. Parameters that can vary significantly with operating voltage and
reference voltage are shown in Section 7.6.
11 Layout
11.1 Layout Guidelines
For best operational performance of the device, use good PCB layout practices, including:
• To avoid converting common-mode signals into differential signals and thermal electromotive forces (EMFs),
make sure that both input paths are symmetrical and well-matched for source impedance and capacitance.
• Place the external gain resistor close to the RG pins to keep the loop inductance as low as possible and to
avoid a potential parasitic coupling path, but also so that capacitance mismatch between the RG pins is
minimized.
• Noise can propagate into analog circuitry through the power pins of the circuit as a whole and of the device.
Bypass capacitors reduce the coupled noise by providing low-impedance power sources local to the analog
circuitry.
– Connect low-ESR, 0.1-µF, ceramic bypass capacitors between each supply pin and ground, placed as
close as possible to the device.
– A single bypass capacitor from V+ to ground is applicable for single-supply applications.
• To reduce parasitic coupling, run the input traces as far away as possible from the supply or output traces. If
these traces cannot be kept separate, crossing the sensitive trace perpendicular is much better than in
parallel with the noisy trace.
• Keep traces as short as possible.
• Minimize the number of thermal junctions. Ideally, the signal path is routed within a single layer without vias.
• Keep sufficient distance from major thermal energy sources (circuits with high power dissipation). If not
possible, place the device such that it matches the thermal energy source on the differential signal path.
www.ti.com
INA849
SBOS945A – NOVEMBER 2020 – REVISED DECEMBER 2020
Copyright © 2020 Texas Instruments Incorporated
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Product Folder Links: INA849



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