ZSSC3170 Datasheet

© 2016 Integrated Device Technology, Inc.

23

May 30, 2016

Figure 3.3

Application Circuit in LIN Mode

Sensor

Bridge

SDA SCL VDD

VBAT

D1

GND

LIN

ZSSC3170 Application Circuit

LIN Mode

n.c.

n.c.

ZSSC3170 Die

C3

220pF

R1 10

Ω

C2

220nF

C1

100nF

Temperature

Sensor

3.2

Dimensioning of External Components

For application circuits, refer to Figure 3.1, Figure 3.2, and Figure 3.3.

Table 3.1

Dimensioning of External Components for Application Examples

No.

Component

Symbol

Condition

Min

Typ

Max

Unit

3.2.1

Capacitor

C1

All modes

100

nF

3.2.2

Capacitor

C2

HSS

470

nF

3.2.3

Capacitor

C2

LSS, LIN

220

nF

3.2.4

Capacitor

C3

HSS

4.7

nF

3.2.5

Capacitor

C3

LSS

2.2

nF

3.2.6

Capacitor

C3

LIN

220

pF

3.2.7

Resistor

R1

LIN

10

W

3.2.8

Resistor

R1

LSS, HSS

27

W

3.2.9

Diode

D1

All modes

Standard Si diode

The capacitor values are examples and must be adapted to the requirements of the specific application, in

particular to the EMC requirements. In the LIN application, the voltage drop over the series connection of D1 and

R1 must not exceed 1V at maximum supply current. For overvoltage pulses at VBAT, R1 serves as a current

limiter.