www.seoulsemicon.com

10

Product Data Sheet

Rev1.2, Sep. 2019

Reflow Soldering Characteristics

Caution

(1) Reflow soldering is recommended not to be done more than two times. In the case of more than

24 hours passed soldering after first, LED will be damaged.

(2) Repairs should not be done after the LED have been soldered. When repair is unavoidable,

suitable tools must be used.

(3) Die slug is to be soldered.

(4) When soldering, do not put stress on the LED during heating.

(5) After soldering, do not warp the circuit board.

IPC/JEDEC J-STD-020

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Average ramp-up rate (Tsmax to Tp)

3° C/second max.

3° C/second max.

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

100 °C

150 °C

60-120 seconds

150 °C

200 °C

60-180 seconds

Time maintained above:

- Temperature (TL)

- Time (tL)

183 °C

60-150 seconds

217 °C

60-150 seconds

Peak Temperature (Tp)

215℃

260℃

Time within 5°C of actual Peak

Temperature (tp)2

10-30 seconds

20-40 seconds

Ramp-down Rate

6 °C/second max.

6 °C/second max.

Time 25°C to Peak Temperature

6 minutes max.

8 minutes max.