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UPS520 Datasheet(PDF) 1 Page - Microsemi Corporation

Part # UPS520
Description  SCHOTTKY BARRIER RECTIFIER 0.5 AMP, 20 VOLT
PDF  4 Pages
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

UPS520 Datasheet(HTML) 1 Page - Microsemi Corporation

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Microsemi
Watertown Division
580 Pleasant Street Watertown, MA 02472 617-926-0404, Fax: 617-924-1235
Page 1
Copyright
 2000
UPS520
.PDF 2001-09-13
UPS520
SCHOTTKY BARRIER RECTIFIER
0.5 AMP, 20 VOLT
WA T E R T O WN D I V I S I O N
DESCRI PTION
DESCRI PTION
DESCRI PTION
DESCRI PTION
In Microsemi’s new Powermite SMT Package, these high efficiency Schottky
rectifiers offer power handling capabilities previously found only in much
larger packages. They are ideal for SMD applications that operate at high
frequencies.
In addition to its size advantages, Powermite package features include a full
metallic bottom that eliminates the possibility of solder flux entrapment during
assembly, and a unique locking tab acts as an integral heat sink. Its
innovative design makes this device ideal for use with automatic insertion
equipment
SURFACE MOUNT
POWERMITE
 Surface Mount Power Package
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
KEY FEATU R ES
KEY FEATU R ES
KEY FEATU R ES
KEY FEATU R ES
Low Profile – Maximum
height of 1.1 mm
Footprint Area of 10 mm
2
Low VF Provides Higher
Efficiency
Low Thermal Resistance
with Direct Thermal Path
of Die on Exposed
Cathode Heat Sink
Supplied in 8mm Tape
and Reel – 3,000 units/7”
Reel; 12,000 units/13” Reel
APPLICATI
APPLICATI
APPLICATI
APPLICATIONS/BENEFITS
ONS/BENEFITS
ONS/BENEFITS
ONS/BENEFITS
High power Surface Mount
Package
Guard Ring Protection
Low forward voltage
Integral Heat Sink/Locking Tabs
Compatible with Automatic
Insertion Equipment
Full Metallic Bottom Eliminates
Flux Entrapment
MECHANICAL CHARACTERISTICS
MECHANICAL CHARACTERISTICS
MECHANICAL CHARACTERISTICS
MECHANICAL CHARACTERISTICS
• Case: Molded Epoxy
• Meets UL94VO at 1/8 inch
• Device Marking S52
• Lead and Mounting Surface Temperature for Soldering = 260°C Maximum
for 10 Seconds


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