R1.0 January 9, 2020

www.seoulsemicon.com

Product Data Sheet

SWWVO112E

– WICOP

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Printed Circuit Board Design Guideline

WICOP is recommended to be soldered onto a Metal Core PCB (MCPCB) for optimal performance and to

designed to minimize the overall thermal resistance between the LED and the heat sink.

Figure 3. PCB layout recommendations

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(1) Silk Color :

The performance of an WICOP can be impacted by the color of the silk screen used on the PCB.

There can be an efficacy loss due to optical absorption by a black color. It is recommended to either use yellow

color for the silk screen or not to use any markings around a WICOP as shown in Figure 2.

(2) PCB Artwork :

The PCB design for the WICOP Series can impact the thermal performance of the end product.

Figure 3 shows two different artwork designs for the same circuit.

The red pattern indicate the copper traces. Wide copper traces should be used to allow a robust thermal path

for the anode and cathode pads.

<Note> Array Process Guideline (Solder Paste)

Seoul semiconductor recommends to use no-clean solder paste, SnAgCu (tin/silver/copper) of solder paste

compositions. (SAC 305 series)

Figure 2. WICOP Silk color Recommendations

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