ASMC-PXB9 datasheet(5/9 Pages) HP

5 / 9 page

Figure 6a. Recommended Sn-Pb reflow soldering profile.

240

°C MAX.

20 SEC. MAX.

°C/SEC.

MAX.

120 SEC. MAX.

TIME

183

°C

100-150

°C

–6

°C/SEC.

MAX.

60-150 SEC.

°C/SEC. MAX.

217

°C

MAX. 120 SEC.

°C/SEC. MAX.

125

°C ± 25 °C

255

°C

60 to 150 SEC.

10 to 20 SEC.

TIME

* THE TIME FROM 25

°C TO PEAK TEMPERATURE = 6 MINUTES MAX.

°C

-0

°C

Figure 6b. Recommended Pb-free reflow soldering profile.

LAMINAR WAVE

BOTTOM SIDE

OF PC BOARD

HOT AIR KNIFE

TURBULENT WAVE

FLUXING

PREHEAT

010

100

150

200

250

TIME – SECONDS

100

TOP SIDE OF

PC BOARD

CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)

PREHEAT SETTING = 150

°C (100°C PCB)

SOLDER WAVE TEMPERATURE = 245

°C

AIR KNIFE AIR TEMPERATURE = 390

°C

AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)

AIR KNIFE ANGLE = 40

SOLDER: SN63; FLUX: RMA

NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED

BEFORE EXERTING MECHANICAL FORCE.

Figure 7. Recommended wave soldering profile.

ASMC-PXB9 Datasheet(PDF) 5 Page - Agilent(Hewlett-Packard)

ASMC-PXB9 Datasheet(HTML) 5 Page - Agilent(Hewlett-Packard)

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