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LDW11T-331M Datasheet(PDF) 4 Page - Shanghai Leiditech Electronic Technology Co., Ltd

Part # LDW11T-331M
Description  Sealed Power Inductors
PDF  8 Pages
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Manufacturer  LEIDITECH [Shanghai Leiditech Electronic Technology Co., Ltd]
Direct Link  http://www.leiditech.com
Logo LEIDITECH - Shanghai Leiditech Electronic Technology Co., Ltd

LDW11T-331M Datasheet(HTML) 4 Page - Shanghai Leiditech Electronic Technology Co., Ltd

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9 Common Mode Choke / RELIABILITY TEST
1-1.Environmental Performance
No
Item
Specification
Test Method
1-1-1 Temperature Cycle
Appearance: No Damage
One cycle:
Impedance: within±20% of
Step Temperature (
℃)
Time (min)
initial value
1
-40±3
30
2
25±2
3
3
105±3
30
4
25±2
3
Total: 5 cycles
Measured After Exposure in The Room Condition For 1hrs
1-1-2 Humidity Resistance
Temperature: 40±2
℃
Relative Humidity: 90 ~ 95%
Time: 100hrs
Measured After Exposure In The Room Condition For 1hrs
1-1-3 High Temperature Resistance
Temperature: 85±3
℃
Time: 50Hrs
Measured After Exposure In The Room Condition For 1Hrs
1-1-4 Low Temperature Resistance
Temperature: -40±3
℃
Time: 50Hrs
Measured After Exposure In The Room Condition For 1Hrs
1-1-5 High Temperature Load Life
There should be no evidence Temperature: 85±3
℃
of short or open circle
Load: Allowed DC Current
Time: 500Hrs
1-1-6 Humidity Load Life
Temperature: 40±2
℃
Relative Humidity: 90~95%
Load: Allowed DC Current
Time: 500Hrs
1-2.Mechanical Performance
No
Item
Specification
Test Method
1-2-1 Resistance To Soldering Heat
Appearance: No Damage
1. The device should be reflow soldered on PCB
(peak 260
℃±5℃ for 10 seconds)
2. Solder Composition: Sn/Ag3.0/Cu0.5
3. Test time: 6 minutes
1-2-2 Solder ability
The electrodes shall be
1. Pre-Heating: 150
℃,1min.
at least 95% covered
2. Solder Composition: Sn/Ag3.0/Cu0.5
with new solder coating
3. Solder Temperature: 245±5
℃.
4. Immersion Time: 4±1 sec.
1-2-3 Commponent Adhesion
1 Lbs. For CUW11/MCF11
The device should be reflow soldered (245±5
℃ For
(Push Test)
2 Lbs. For other
10 seconds) to a tinned copper substrate. A force guauge
should be applied to the side of the component.
The device must withstand a minimum force of 2 pounds
without a failure of the termination attached to component
LDW11T Series
Rev :
www.leiditech.com
01.06.2018
4/8



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