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LDW11T-331M Datasheet(PDF) 4 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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LDW11T-331M Datasheet(HTML) 4 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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4 / 8 page ![]() 9 Common Mode Choke / RELIABILITY TEST 1-1.Environmental Performance No Item Specification Test Method 1-1-1 Temperature Cycle Appearance: No Damage One cycle: Impedance: within±20% of Step Temperature ( ℃) Time (min) initial value 1 -40±3 30 2 25±2 3 3 105±3 30 4 25±2 3 Total: 5 cycles Measured After Exposure in The Room Condition For 1hrs 1-1-2 Humidity Resistance Temperature: 40±2 ℃ Relative Humidity: 90 ~ 95% Time: 100hrs Measured After Exposure In The Room Condition For 1hrs 1-1-3 High Temperature Resistance Temperature: 85±3 ℃ Time: 50Hrs Measured After Exposure In The Room Condition For 1Hrs 1-1-4 Low Temperature Resistance Temperature: -40±3 ℃ Time: 50Hrs Measured After Exposure In The Room Condition For 1Hrs 1-1-5 High Temperature Load Life There should be no evidence Temperature: 85±3 ℃ of short or open circle Load: Allowed DC Current Time: 500Hrs 1-1-6 Humidity Load Life Temperature: 40±2 ℃ Relative Humidity: 90~95% Load: Allowed DC Current Time: 500Hrs 1-2.Mechanical Performance No Item Specification Test Method 1-2-1 Resistance To Soldering Heat Appearance: No Damage 1. The device should be reflow soldered on PCB (peak 260 ℃±5℃ for 10 seconds) 2. Solder Composition: Sn/Ag3.0/Cu0.5 3. Test time: 6 minutes 1-2-2 Solder ability The electrodes shall be 1. Pre-Heating: 150 ℃,1min. at least 95% covered 2. Solder Composition: Sn/Ag3.0/Cu0.5 with new solder coating 3. Solder Temperature: 245±5 ℃. 4. Immersion Time: 4±1 sec. 1-2-3 Commponent Adhesion 1 Lbs. For CUW11/MCF11 The device should be reflow soldered (245±5 ℃ For (Push Test) 2 Lbs. For other 10 seconds) to a tinned copper substrate. A force guauge should be applied to the side of the component. The device must withstand a minimum force of 2 pounds without a failure of the termination attached to component LDW11T Series Rev : www.leiditech.com 01.06.2018 4/8 |
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