6.4 Thermal Information

THERMAL METRIC

(1)

ISO672xB

UNIT

D (SOIC)

8 PINS

Junction-to-ambient thermal resistance

104.6

°C/W

Junction-to-case (top) thermal resistance

48.9

°C/W

Junction-to-board thermal resistance

52.9

°C/W

Junction-to-top characterization parameter

7.9

°C/W

Junction-to-board characterization parameter

52.1

°C/W

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO6720B

Maximum power dissipation (both sides)

15 pF, Input a 25-MHz 50% duty cycle

square wave

71.2

mW

Maximum power dissipation (side-1)

19.3

mW

Maximum power dissipation (side-2)

51.9

mW

ISO6721B

Maximum power dissipation (both sides)

15 pF, Input a 25-MHz 50% duty cycle

square wave

72.7

mW

Maximum power dissipation (side-1)

36.35

mW

Maximum power dissipation (side-2)

36.35

mW

ISO6720, ISO6721

SLLSFJ0B – JANUARY 2020 – REVISED MARCH 2021

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