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SM150 Datasheet(PDF) 1 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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SM150 Datasheet(HTML) 1 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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1 / 1 page ![]() Features Small size of 1812 Fast tripping resettable circuit protection Surface mount packaging for automated assembly Agency Recognition: UL、CSA、TUV Product Dimensions (mm) A B C D Part number Max Max Max Max SM150 9.50 3.00 6.71 0.70 Part Marking System Electrical Characteristics IH IT Vmax Imax Ttrip Pd typ Rmin R1max Part number (A) (A) (V) (A) Current(A) Time(S) (W) (Ω) (Ω) SM150 1.50 3.00 33 40 8.0 5.0 2.1 0.060 0.250 IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Solder Reflow Recommendations Solder Pad Layouts C A BB A A B C Part number (mm) (mm) (mm) SM150 4.6 2.3 10.7 * Recommended reflow methods: IR, Vapor phase oven, hot air oven, wave solder. * Devices can be cleaned using standard industry methods and solvents. 50 100 150 250 Stable Heat Preheat 40 80 120 160 200 240 280 320 360 t(sec) T( ) ℃ Reflow 200 Cool Maximum package Body Temperature(240 ) ℃ Melting Temperature of Solder(183 ) ℃ Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Package Information Tape & Reel: 2000pcs per reel. Wayon symbol Current rating SM150 Phone: +86- 021-50828806 Email:sale1@leiditech.com http://www.leiditech.com SHANGHAI LEIDITECH ELECTRONICS TECHNOLOGY CO., LTD 1/1 |
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