CMF02A

2

5.

5.

5.

5. Thermal Characteristics

Thermal Characteristics

Thermal Characteristics

Thermal Characteristics

Characteristics

Thermal resistance (junction-to-ambient)

Thermal resistance (junction-to-lead)

Symbol

Test Condition

Device mounted on a ceramic board

Board size: 50 mm × 50 mm

Soldering land size: 2 mm × 2 mm

Board thickness: 0.64 mm

Device mounted on a glass-epoxy board

Board size: 50 mm × 50 mm

Soldering land size: 6 mm × 6 mm

Board thickness: 1.6 mm



Max

60

125

16

Unit

/W

6.

6.

6.

6. Electrical Characteristics (Unless otherwise specified, T

Electrical Characteristics (Unless otherwise specified, T

Electrical Characteristics (Unless otherwise specified, T

= 25

= 25

= 25





))))

Characteristics

Peak forward voltage

Repetitive peak reverse current

Reverse recovery time

Symbol

Test Condition

Min











Typ.

0.9

1.4

1.5





Max





2.0

50

100

Unit

V

µA

ns

7.

7.

7.

7. Marking

Marking

Marking

Marking

Fig.

Fig.

Fig.

Fig. 7.1

7.1

7.1

7.1 Marking

Marking

Marking

Marking

Marking Code

F2A

Part Number

CMF02A

8.

8.

8.

8. Land Pattern Dimensions (for reference only)

Land Pattern Dimensions (for reference only)

Land Pattern Dimensions (for reference only)

Land Pattern Dimensions (for reference only)

Fig.

Fig.

Fig.

Fig. 8.1

8.1

8.1

8.1 Land Pattern Dimensions for Reference Only (Unit: mm)

Land Pattern Dimensions for Reference Only (Unit: mm)

Land Pattern Dimensions for Reference Only (Unit: mm)

Land Pattern Dimensions for Reference Only (Unit: mm)

2020-04-01

Rev.1.0

©2020

Toshiba Electronic Devices & Storage Corporation