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VSSAF515HM3/I Datasheet(PDF) 4 Page - Vishay Siliconix |
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VSSAF515HM3/I Datasheet(HTML) 4 Page - Vishay Siliconix |
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4 / 5 page ![]() VSSAF515 www.vishay.com Vishay General Semiconductor Revision: 04-May-2018 4 Document Number: 87612 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Fig. 7 - Thermal Resistance Junction to Ambient vs. Copper Pad Area PACKAGE OUTLINE DIMENSIONS in inches (millimeters) 0 20 40 60 80 100 120 0123456789 10 Copper Pad Areas (cm2) Epoxy printed circuit board FR4 copper thickness = 70 μm S (cm2) SlimSMA (DO-221AC) Cathode Band 0.106 (2.70) 0.098 (2.50) 0.047 (1.20) 0.030 (0.75) 0.047 (1.20) MIN. 0.047 (1.20) MIN. 0.123 (3.12) MAX. 0.217 (5.52) REF. 0.060 (1.52) MIN. 0.057 (1.45) 0.049 (1.25) 0.039 (1.00) 0.035 (0.90) 0.012 (0.30) 0.006 (0.15) 0.171 (4.35) 0.163 (4.15) 0.211 (5.35) 0.199 (5.05) Typ.: 0.019 (0.48) Mounting Pad Layout |
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