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DSPIC30F2012 Datasheet(PDF) 195 Page - Microchip Technology |
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DSPIC30F2012 Datasheet(HTML) 195 Page - Microchip Technology |
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195 / 207 page  © 2005 Microchip Technology Inc. Preliminary DS70139C-page 193 dsPIC30F2011/2012/3012/3013 28-Lead Plastic Quad Flat No Lead Package (ML) 6x6x0.9 mm Body (QFN-S) – With 0.40 mm Contact Length (Saw Singulated) Lead Width *Controlling Parameter Drawing No. C04-124 Notes: JEDEC equivalent: MO-220 b .013 .015 .017 0.33 0.38 0.43 Pitch Number of Pins Overall Width Standoff Overall Length Overall Height MAX Units Dimension Limits A1 D E n e A .000 INCHES .026 BSC MIN 28 NOM MAX .002 0.00 6.00 MILLIMETERS* .039 MIN 28 0.65 BSC NOM 0.05 1.00 0.90 .035 .001 0.02 Lead Length L .012 .016 .020 0.30 0.40 0.50 E2 D2 Exposed Pad Width Exposed Pad Length .169 .175 .177 4.30 4.45 4.50 .031 0.80 5.90 6.10 .240 .236 .232 .232 .236 6.00 .240 5.90 6.10 .169 .175 4.45 .177 4.30 4.50 b D2 D A1 A TOP VIEW OPTIONAL INDEX AREA 1 2 L BOTTOM VIEW n E METAL PAD ALTERNATE EXPOSED INDICATORS INDEX e E2 Revised 05/24/04 |
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