| Electronic Components Datasheet Search |
|
TSB712IDT Datasheet(PDF) 23 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
TSB712IDT Datasheet(HTML) 23 Page - STMicroelectronics |
|
23 / 36 page ![]() 5.9 PCB layout recommendations Particular attention must be paid to the layout of the PCB tracks connected to the amplifier, load, and power supply. The power and ground traces are critical as they must provide adequate energy and grounding for all circuits. The best practice is to use short and wide PCB traces to minimize voltage drops and parasitic inductance. In addition, to minimize parasitic impedance over the entire surface, a multi-via technique that connects the bottom and top layer ground planes together in many locations is often used. The copper traces connecting the output pins to the load and supply pins should be as wide as possible to minimize trace resistance. 5.10 Decoupling capacitor In order to ensure op-amp full functionality, it is mandatory to place a decoupling capacitor of at least 22 nF as close as possible to the op-amp supply pin. A good decoupling helps to reduce electromagnetic interference impact. TSB711, TSB711A, TSB712, TSB712A, TSB714, TSB714A PCB layout recommendations DS12487 - Rev 6 page 23/36 |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |