FMM5709X datasheet(8/9 Pages) ETC1

8 / 9 page

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■DIE ATTACH

1) The die-attach station must have accurate temperature control, and an inert forming gas should

be used.

2)Chips should be kept at room temperature except during die-attach.

3) Place package or carrier on the heated stage.

4) Lightly grasp the chip edges by the longer side using tweezers.

Die attach conditions

Stage Temperature : 300 to 310 deg.C

Time : less than 15 seconds

AuSn Perform Volume : per next Figure

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■ WIRE BONDING

The bonding equipment must be properly grounded. The following or equivalent equipment, tools,

materials, and conditions are recommended.

1) Bonding Equipment and Bonding Tool.

Bonding Equipment : West Bond Model 7400 (Manual Bonder)

Bonding Tool : CCOD-1/16-S-437-60-F-2010-MP (Deweyl)

2) Bonding Wire

Material : Hard or Half hard gold

Diameter : 0.7 to 1.0 mil

3) Bonding Conditions

Method : Thermal Compression Bonding with Ultrasonic Power

Tool Force : 0.196 N +/- 0.0196 N

Stage Temperature : 215 deg.C +/- 5 deg.C

Tool Heater : None

Ultrasonic Power Transmitter : West Bond Model 1400

Duration : 150 mS/Bond

100

200

300

400

500

012

345

Area of Chip Back Surface (mm^2)

FMM5709X

K / Ka Band Low Noise Amplifier MMIC

FMM5709X

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