PIMXRT516SCVP2A datasheet(1/124 Pages) NXP

Part #	PIMXRT516SCVP2A

Description	i.MX RT1160 Crossover Processors Data Sheet for Consumer Products

PDF	124 Pages

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Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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NXP Semiconductors

Data Sheet: Technical Data

Document Number:IMXRT1160CEC

Rev. 0, 04/2021

MIMXRT1166DVM6A

MIMXRT1165DVM6A

Package Information

Plastic Package

289-pin MAPBGA, 14 x 14 mm, 0.8 mm pitch

Ordering Information

See Table 1 on page 6

NXP reserves the right to change the production detail specifications as may be required

to permit improvements in the design of its products.

1

i.MX RT1160 introduction

The i.MX RT1160 is a new high-end processor of i.MX

RT family, which features NXP’s advanced

implementation of a high performance Arm

Cortex®-M7 core operating at speeds up to 600 MHz

and a power efficient Cortex®-M4 core up to 240 MHz.

The i.MX RT1160 processor has 1 MB on-chip RAM in

total, including a 768 KB RAM which can be flexibly

configured as TCM (512 KB RAM shared with M7 TCM

and 256 KB RAM shared with M4 TCM) or

general-purpose on-chip RAM. The i.MX RT1160

integrates advanced power management module with

DCDC and LDO regulators that reduce complexity of

external power supply and simplifies power sequencing.

The i.MX RT1160 also provides various memory

interfaces, including SDRAM, RAW NAND FLASH,

NOR FLASH, SD/eMMC, Quad/Octal SPI, Hyper

RAM/Flash, and a wide range of other interfaces for

connecting peripherals, such as WLAN, Bluetooth™,

GPS, displays, and camera sensors. The i.MX RT1160

i.MX RT1160 Crossover

Processors Data Sheet

for Consumer Products

1. i.MX RT1160 introduction . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 6

1.3. Package marking information . . . . . . . . . . . . . . . . 9

2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.1. Special signal considerations . . . . . . . . . . . . . . . 20

3.2. Recommended connections for unused analog

interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 23

4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 23

4.2. System power and clocks . . . . . . . . . . . . . . . . . . 32

4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 42

4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 50

4.5. External memory interface . . . . . . . . . . . . . . . . . 54

4.6. Display and graphics . . . . . . . . . . . . . . . . . . . . . . 64

4.7. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

4.8. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

4.9. Communication interfaces . . . . . . . . . . . . . . . . . . 81

4.10. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

5.

Boot mode configuration . . . . . . . . . . . . . . . . . . . 99

5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 99

5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 99

5.2. Boot device interface allocation . . . . . . . . . . . . . . 99

6. Package information and contact assignments . . . . . . 105

6.1. 14 x 14 mm package information . . . . . . . . . . . 105

7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

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