ISO7741FDW datasheet(30/52 Pages) TI

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INA

INB

INC

OUTD

OUTA

OUTB

OUTC

IND

GND2

VCC2

2 mm maximum

from VCC2

EN2

GND2

EN1

GND1

2 mm maximum

from VCC1

GND1

VCC1

0.1 µF

ISO7740, ISO7741, ISO7742

SLLSEP4G – MARCH 2016 – REVISED FEBRUARY 2020

www.ti.com

Product Folder Links: ISO7740 ISO7741 ISO7742

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Typical Application (continued)

10.2.1 Design Requirements

To design with these devices, use the parameters listed in Table 3.

Table 3. Design Parameters

PARAMETER

VALUE

Supply voltage, VCC1 and VCC2

2.25 to 5.5 V

Decoupling capacitor between VCC1 and GND1

0.1 µF

Decoupling capacitor from VCC2 and GND2

0.1 µF

10.2.2 Detailed Design Procedure

Unlike optocouplers, which require external components to improve performance, provide bias, or limit current,

the ISO774x family of devices only require two external bypass capacitors to operate.

Figure 23. Typical ISO774x Circuit Hook-up

The DWW package provides wider creepage and clearance without the need for two isolators in series or an

extra isolated power supply, saving design cost and board space. For more details, please refer to the technical

document How to Meet the Higher Isolation Creepage & Clearance Needs in Automotive Applications.

ISO7741FDW Datasheet(PDF) 30 Page - Texas Instruments

ISO7741FDW Datasheet(HTML) 30 Page - Texas Instruments

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