ISO7741FDWR datasheet(9/52 Pages) TI

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ISO7740, ISO7741, ISO7742

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SLLSEP4G – MARCH 2016 – REVISED FEBRUARY 2020

Product Folder Links: ISO7740 ISO7741 ISO7742

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For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

ISO774x

UNIT

DWW (SOIC)

DW (SOIC)

DBQ

(QSOP)

16 Pins

RθJA

Junction-to-ambient thermal resistance

58.3

83.4

109

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

21.4

54.4

°C/W

RθJB

Junction-to-board thermal resistance

30.5

51.9

°C/W

ψJT

Junction-to-top characterization parameter

7.1

19.1

14.2

°C/W

ψJB

Junction-to-board characterization parameter

29.8

47.5

51.4

°C/W

RθJC(bottom)

Junction-to-case(bottom) thermal resistance

—

°C/W

7.5 Power Rating

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO7740

Maximum power dissipation

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF,

Input a 50-MHz 50% duty cycle square wave

200

PD1

Maximum power dissipation by side-1

PD2

Maximum power dissipation by side-2

160

ISO7741

Maximum power dissipation

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF,

Input a 50-MHz 50% duty cycle square wave

200

PD1

Maximum power dissipation by side-1

PD2

Maximum power dissipation by side-2

125

ISO7742

Maximum power dissipation

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF,

Input a 50-MHz 50% duty cycle square wave

200

PD1

Maximum power dissipation by side-1

100

PD2

Maximum power dissipation by side-2

100

ISO7741FDWR Datasheet(PDF) 9 Page - Texas Instruments

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